Activity Measurements of Copper in Solid Copper-Nickel Alloys using Copper-Beta-Alumina

Soldering and brazing of copper and copper alloys

Wettability of Brazing Filler Metals on Copper and Copper Alloys

The possibility of alloying can not be avoided at the interface between molten brazing filler metal and base metal in brazing, so the wettability of brazing filler metal can not be easily explained theoretically. We used the original apparatus for wettability test and investigated the relation between the wettability of brazing filler metals of Ag-P-Cu and Ag-Cu-Zn-Cd systems on copper and the ...

Electronic structure of copper-rich copper-gold alloys.

We present and discuss angle-resolved photoemission measurements from the (111) and (100) faces of CuAu single crystals containing 10 at. %%u oA u in th ebul k, togethe rwit hcomputation sof complex-energy bands and densities of states in the Cu90Aulo random alloy. Our calculations permit (.' a good understanding of the shifts and smearings in t e spectrum of Cu arising from the addition of Au ...

Inhibition Mechanisms of Organic Compounds on Copper and Copper Alloys

Catalytic reduction of SO2 with CH4 to elemental sulfur: A comparative analysis of alumina, copper-alumina and nickel-alumina catalysts

The catalytic reduction of sulfur dioxide with methane to form elemental sulfur has been studied. Al2O3, Cu-Al2O3 and Ni-Al2O3 were examined as catalysts and their performances were compared in terms of SO2 conversion and selectivity. Performance of the catalyst extremely enhanced when nickel and copper were added as promoters. The effects of temperature, SO2/CH4 molar ratio, and reaction...